Roots Blowers for Electroplating Bath Air Agitation

For tank air agitation, roots blowers for electroplating must match bath depth, sparger resistance and required circulation. The component being plated normally acts as the cathode, while the electrolyte contains dissolved ions of the metal to be deposited.

As metal ions are consumed at the cathode surface, their local concentration can become lower than the concentration in the bulk solution. If the electrolyte near the component is not renewed sufficiently, a concentration boundary layer develops and restricts mass transfer.

Air agitation uses bubbles and the resulting liquid circulation to move fresh electrolyte toward the workpiece. Where the bath chemistry permits aeration, a roots blower can provide the continuous, low-pressure and oil-free airflow required by the tank’s sparger system.

How Air Agitation Influences Electroplating

The electrochemical reaction at the component surface depends partly on the transport of metal ions through the liquid boundary layer. The theoretical limiting current density can be represented by:

Limiting Current Density

iL  =  n  ×  F  ×  km  ×  Cb
where:
  • iL = limiting current density
  • n = number of electrons transferred per metal ion
  • F = Faraday constant
  • km = mass-transfer coefficient
  • Cb = metal-ion concentration in the bulk electrolyte

Air agitation can increase the mass-transfer coefficient by reducing the effective thickness of the stagnant boundary layer. This allows the electrolyte adjacent to the cathode to be renewed more rapidly.

Depending on the bath chemistry and operating conditions, controlled air agitation may provide:

  • More uniform metal-ion concentration
  • Reduced concentration polarization
  • Improved coating distribution
  • More consistent brightness and surface texture
  • Better removal of hydrogen bubbles
  • Improved temperature uniformity
  • Reduced localized depletion near the cathode
  • Higher practical current density in approved processes
  • Better contact between the solution and recessed surfaces

The effect is not determined only by total airflow. Bubble distribution, sparger location, component loading and rack geometry influence how the electrolyte moves through the tank.

A high airflow concentrated in one area may produce strong local turbulence while other parts of the tank remain poorly mixed. Uniform air distribution is therefore more important than simply installing a high-capacity blower.

Calculating Pressure and Airflow

The roots blower must produce sufficient pressure to force air through the sparger openings against the hydrostatic pressure of the plating solution.

The minimum theoretical hydrostatic pressure is:

Hydrostatic Pressure

ph  =  ρs  ×  g  ×  h
where:
  • ph = hydrostatic pressure at the sparger
  • ρs = plating-solution density
  • g = gravitational acceleration
  • h = vertical liquid depth above the sparger

The total required blower pressure is:

Total Required Blower Differential Pressure

ptotal  =  ph  +  Δppipe  +  Δpvalve  +  Δpsparger
where:
  • ptotal = total required blower differential pressure
  • ph = hydrostatic pressure at the sparger
  • Δppipe = pipeline and fitting losses
  • Δpvalve = control and isolation valve losses
  • Δpsparger = pressure loss across the sparger openings

For a plating solution with a density of 1,200 kg/m³ and a sparger depth of 1.5 m:

ph = 1,200 × 9.81 × 1.5

ph = 17,658 Pa

ph ≈ 177 mbar

This is only the hydrostatic component. If the combined pipeline, valve and sparger loss is 80 mbar:

ptotal = 177 + 80

ptotal = 257 mbar

The blower should then be selected to deliver the required process airflow at a differential pressure of at least 257 mbar, together with an appropriate design allowance.

The airflow requirement can be expressed in terms of effective tank area:

Required Agitation Airflow

Q  =  Aeff  ×  qA
where:
  • Q = required agitation airflow
  • Aeff = effective tank or process area
  • qA = process-specific airflow rate per unit area

The value of q_A should be obtained from the plating-chemical supplier, process designer or validated production data. A universal airflow rate should not be applied to every electroplating bath because agitation requirements differ among copper, nickel, zinc and other processes.

If multiple tanks operate from one blower:

Total Required Airflow

Qtotal  =  Σ( Qi  ×  fi )  +  Qsystem
where:
  • Qtotal = total required airflow
  • Qi = airflow required by each tank
  • fi = simultaneous-operation factor
  • Qsystem = allowance for controlled system losses

Intentional airflow through relief or bypass valves should not be treated as useful process demand. Excessive bypass flow represents wasted energy.

Sparger and Distribution-System Design

Air is commonly introduced through perforated pipes positioned near the tank floor and below the working area. The sparger arrangement should distribute bubbles uniformly beneath the components without disturbing sediment accumulated at the bottom of the tank.

Important design parameters include:

  • Number of sparger branches
  • Pipe internal diameter
  • Total sparger length
  • Hole diameter
  • Hole spacing and orientation
  • Distance from the tank floor
  • Component and anode positions
  • Required bubble distribution
  • Resistance of the pipe material to the bath chemistry
  • Maximum operating temperature

Spargers mounted directly on the bottom can disturb settled particles and carry them back toward the plated components. Raising the spargers above the floor can reduce this risk and improve access for cleaning.

The internal area of the distribution pipe must be sufficient to prevent excessive pressure variation along its length. If the pipe is too small, the openings near the air inlet can receive more flow than those at the remote end.

For a simplified low-pressure sparger opening, airflow through one hole may be approximated by:

Airflow Through One Hole

Qh  =  Cd  ×  Ah
×  √
(
2  ×  Δph
ρair
)
where:
  • Qh = airflow through one hole
  • Cd = discharge coefficient
  • Ah = area of one opening
  • Δph = pressure difference across the opening
  • ρair = air density at the applicable condition
The approximate number of openings is:
N  = 
Qtotal
Qh

These equations provide only a preliminary estimate. Air is compressible, and actual hole flow depends on upstream absolute pressure, temperature, manufacturing tolerance and the pressure inside the bath. Final sparger design should be verified under operating conditions.

Branches serving separate tanks should include isolation and balancing devices. A tank with shallower solution or lower sparger resistance will otherwise receive more air than a deeper or more restrictive tank.

Excessive throttling should be avoided because the roots blower continues displacing air as system resistance increases. Closing several tank branches without reducing blower capacity can rapidly increase discharge pressure, absorbed power and temperature.

Air Quality and Process Compatibility

A roots blower normally transports air without injecting lubricant into the compression chamber. The process air does not contact the oil contained in the timing-gear and bearing compartments during normal operation.

This is preferable to using untreated plant compressed air, which may contain compressor lubricant, condensed water or corrosion particles. Even a small amount of oil can interfere with deposit adhesion, brightness and bath chemistry.

Glossary

Anode: Electrode at which oxidation occurs in the electroplating circuit.
Bath circulation: Movement of electrolyte that distributes temperature and dissolved species.
Cathode: Workpiece electrode on which metal ions are reduced and deposited.
Current density: Electrical current divided by the active electrode area.
Electrode gap: Distance between the anode and cathode in the electroplating cell.
Electrolyte: Conductive solution containing ions used in the plating process.
Gas dispersion: Distribution of injected air bubbles through the electrolyte bath.
Sparger: Perforated pipe that distributes air beneath the plating bath surface.